Chiplet Summit

Chiplets Make Huge Chips Happen

January 24-26, 2023

San Jose, California

Conference & Exhibition

This is going to be HUGE!

Chiplet Summit Is the
#1 Place to Exhibit

Position Your Company as a Leader in an Emerging Technology.  Lay Claim to Your Share of a Projected $5.8 Billion Market (Omdia).  Share Thoughts with Key Experts and Analysts.  Show Movers and Shakers How Your Products and Roadmap Will Drive the Industry. Meet Highly Motivated Customer Prospects.

  • Only event totally dedicated to the skyrocketing chiplet market 

  • Top experts, major keynotes, and critical topics will draw big-time customers

  • Practical orientation will attract key designers and specifiers

  • Vendor-neutral show offers opportunities to everyone

Video Courtesy of CNET Highlights

About the Event

The First Annual Chiplet Summit is the show chip designers can’t miss if they want to stay competitive. 

They’ll get the scoop on ways to make their chiplets run faster, scale better, use less power, and be more flexible.

This unique event gives attendees a place to network with peers, ask questions of the experts, and talk to vendors offering a wide variety of products and services.

“Chiplets are expected to return to the two-year doubling cycle that has been the cornerstone economics of the semiconductor business since 1965.” – John Blyler, Design News, September 2021

Central Topics at Chiplet Summit:

                • Application Areas/Use Cases
                • Development Platforms
                • Optimization  
                • Architectures
                • Packaging, Integration, and Test

Sessions on the Latest Technology and Market Trends

Annual Update

Latest Market Research

Chiplets in 2028

Thought-Provoking Panels Where Attendees Can Ask Questions of Leading Experts:

  • Choosing the Right Architecture for Your Application
  • Next Great Breakthrough in Chiplets
  • Best Development Platform for Chiplets
  • Best Interface for Chiplets
  • What Standards Are Needed?
  • Optimizing Chiplets

 

ATTENDEES

Engineers and managers who are looking for ways to help meet performance challenges, handle the move to smaller dimensions, provide the modularity and scalability today’s chips require, and develop solutions focused on the latest applications and interfaces.  Designers of enterprise networks, telecom systems, high-performance computing, financial systems, IoT, and mil/aero applications all know that chiplets will play a big role in their future.  

BACKGROUND

Chiplets improve chip yields and costs, but still provide the performance of a large monolithic chip.  Designers can mix-and-match chiplets, use the process technologies best suited to particular functions, take advantage of chiplet IP, simplify moves to new process nodes,  and avoid wafer waste and manufacturing defects.  Chiplets are the key to producing the extremely high-density, high-performance chips required for today’s networking, storage, AI/ML, analytics, media processing, HPC, and virtual reality applications. 

2023 Exhibit & Sponsorship Packages

Founding Keynote Sponsorships (6 available)

    • Keynote (30 minutes)
    • Table exhibit space
    • Logo on signage
    • Three program passes ($1,595 value each)

$25,000

Gold Sponsorships  (9 available)

    • One sponsorship item from among Luncheon (3), Reception, Registration, Signage, Audiovisual, Beer Pizza, and Website
    • Table exhibit space
    • Two program passes ($1,595 value each)

$10,000

Bronze Sponsorship (24 available)            

    • One sponsorship from among Continental Breakfasts (3), Refreshment Breaks (6), Panel Sessions (6), or Pre-Conference Tutorials (8)
    • Table exhibit space
    • One program pass ($1,595 value)

$4,000

Exhibit table package 

    • Includes 6’ table
    • Two chairs
    • Standard electricity

$2,500

Official Networking Exhibit Hours (no conflicting sessions)

Wednesday, January 25, Noon – 2 pm and 5 – 7 pm

Thursday, January 26, Noon – 2 pm

2023 Exhibit & Sponsorship Sign Up