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Best of Show Awards

Chiplet Summit 2026 - all three awards

Packaging:
Design

Winner: Siemens EDA for “Innovator3D IC”

Siemens’ Innovator3D IC stands out with its combination of design lifecycle coverage and breadth of industry-standard data models.

2026 Packaging Design Award

Packaging:
Hardware

Winner: Sarcina Technology for its “Advanced Packaging”

Sarcina democratized chiplet packaging, enabling startups in communications and AI compute to compete on equal footing with the top-tier incumbents.

2026 Packaging Hardware Award

Connectivity & Interoperability

Winner: UCIe Consortium, “UCIe 3.0 Specification”

The UCIe Consortium represents a broad range of leading technology companies who see the importance of expanding the chiplet ecosystem. Their 3.0 specification increases die-to-die data rates, power efficiency, and system-level manageability.

2026 Connectivity & Interoperability Award

Nominate

Award Categories

Chiplet Summit 2026 will recognize excellence in three key areas central to the advancement of chiplet technologies.

Chiplet Summit 2026 will feature our first ever Best of Show awards!

Nominations are open until January 23, 2026. You must be a Chiplet Summit 2026 sponsor or exhibitor to be eligible. Nominate your product or service for consideration in any of the three categories we are honoring.

This category honors breakthroughs in compute engines optimized for artificial intelligence and machine learning.

Judges will look for:

  • Significant advancements in performance, efficiency, or scalability.
  • Unique architectural or algorithmic innovations that enable new AI/ML applications.
  • Demonstrated impact on accelerating real-world workloads or improving developer adoption.

This category honors advances in packaging design and substrate technology that enable chiplets to be integrated into high-performance, manufacturable, and cost-effective systems.

Judges will look for:

  • Novel substrates (organic, silicon, glass, or hybrid) that improve power, density, or cost.
  • Innovations in package architecture, assembly, or thermal management.
  • Clear pathways to volume manufacturing and ecosystem adoption.
  • Solutions that reduce integration risk and enhance overall system reliability.

This category honors technologies that allow chiplets from different vendors and processes to work seamlessly together.

Judges will look for:

  • Demonstrated interoperability (e.g., multi-vendor demos, compliance/”plugfest” results, standard conformance).
  • Robustness at scale: link training, error handling, lane repair, flow control, QoS, and telemetry.
  • Clear alignment with and/or contributions to standards (UCIe, BoW, OpenHBI, CXL-on-package, etc.).
  • Tooling/IP that reduces integration friction (design kits, compliance suites, reference designs).
  • Evidence of ecosystem impact through cross-vendor adoption or accelerated time-to-market.

Judge Requirements & Responsibilities

To ensure a fair, transparent, and credible judging process, all Chiplet Summit 2026 Best of Show (BoS) judges must meet the following qualifications and adhere to these responsibilities.

  • Judges must not have financial interests, organizational ties, or competitive conflicts with companies or technologies in the category they are assigned.
  • Judges must disclose any potential conflict immediately to the BoS coordinator.
  • This is a volunteer (unpaid) position. However, judges are eligible for a free Exhibits Plus pass.
  • Judges should have a minimum of 5 years of professional or academic experience in one or more of the following chiplet-related areas:
    • AI Accelerators
    • Packaging and Integration
    • Architecture
  • Judges are expected to review all assigned nominations in a timely manner, before the pre-show deadline.
  • Judges must be available for remote (virtual) deliberation session(s).
  • Judges are encouraged, but not required, to attend Chiplet Summit and the associated BoS Award Ceremony.
  • If a judge becomes unable to complete their duties, they will notify the BoS coordinator immediately and, if possible, suggest a suitable replacement.
  • All nomination materials must be treated as confidential. Judges may not disclose or share submission content outside of the judging process.
  • Judges will not disclose winners or losers of BoS awards until they are made public by Chiplet Summit.
  • Judges will not disclose their participation as a Chiplet Summit BoS judge, outside of their organization before the event.
  • Judges must evaluate nominees solely on the official nomination materials provided.
  • External references, marketing claims, or personal knowledge must not influence scoring.
  • Judges will use the approved Chiplet Summit BoS Award Evaluation Form to report their judgements of each nominee they are assigned.
  • Should conflicts, ties, or differences of opinion occur, Chiplet Summit retains the right to make the sole determination as to BoS winners.

For Your Reference

You can use these links to review the Google Forms for:

If you cannot use Google Forms, you can complete and email this Word nomination form;

By serving as a judge, you uphold Chiplet Summit’s commitment to fairness, integrity, and recognition of innovation in the chiplet ecosystem. If you would like to be considered as a judge, please complete the judge’s interest declaration form.

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