"To show our support and leadership in the field, Achronix was a proud sponsor of and participant in the first annual Chiplet Summit. The event was undoubtedly a great success, full of exciting presentations, collaboration, and interesting ideas being exchanged. Read on to learn about four of our major takeaways from the first annual Chiplet Summit."
"…our attendance next year…seems assured given the success of this year’s event."
"As expected, the 1.0 inaugural event was a success, and the event will naturally increase in size, participation, and attendance in subsequent years."
”Cadence demonstrated multiple IP for die-to-die connectivity at Chiplet Summit 2024. Conference attendees discussed their chiplet and multi-die design needs with our experts and learned how Cadence’s IP can support them in achieving their system needs with optimum PPA targets. Our UCIeTM IP silicon demo created a buzz with its extensive testing.”
“Chiplet Summit 2024 gave designers a great chance to hear unique presentations and witness technology demonstrations on solutions they can use to meet the power, performance, and scalability requirements of their multi-die system designs.”
"Suffice it to say that if you see chiplets in your future, then the Chiplet Summit is the place to ‘see and be seen."
The Chiplet Summit is coming up at the beginning of February. I hope to meet up with you there… The agenda is a who’s who in the chiplet arena.”
“'Heterogeneous technology' and “disaggregation' were key terms used in keynotes, tutorials, panels, and individual sessions throughout the Chiplet Summit… At Credo we are a leader in the IP and Chiplet business. We are in mass production and shipping Chiplets utilizing XSR and BoW (bunch of wire) interface and we have a roadmap that will continue to define us as a leader in this space. The adoption of standards will take time and the barriers to entry will remain high, allowing us to continue to be a pioneer in this space. We will have to wait for next year’s Summit to see the overall progress of the Chiplet business and what improvements and solutions are created in 2024.”'
“At the forefront of innovation, Menta, alongside our strategic research partner CEA-List, is proud to participate in the Second Annual Chiplet Summit, a crucial event for chip designers and market players in the United States.”
“Our demos attracted a lot of attention at the Chiplet Summit with many key partners and customers, who stopped by to understand Cadence’s UCIe offering and talking to our experts. There was a high degree of appreciation for the standard Cadence is setting in testing die-to-die interconnect IP that is becoming increasingly ubiquitous with many players, big and small, both on the design and the use side.”
“This year, most of [the IP, EDA, and ASIC companies] showed up and had a booth to demonstrate their latest technologies and capabilities. The conference offered several good tutorial sessions. The speakers were getting better and better. More and more decision-makers at the C-level participated. Basically, the conference has matured rapidly, and the attracted audience job responsibilities have become higher and higher.”
“I'd love to see more frequent events, can’t wait a whole year :-)”
