Chiplet 2025 Call For Papers
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Chiplet 2025 Call For Papers
2024 Program
2024 Program at a Glance
2024 Keynotes
2024 Tuesday
2024 Wednesday
2024 Thursday
2024 Speaker List
2024 Speaker Resources
2024 Proceedings
2023 Proceedings
Exhibitors / Sponsors
Exhibitors / Sponsors 2025 List
2025 Exhibitor Sponsor Packages
Sponsor Sign Up Form
Why Exhibit
Exhibitor Lead Capture
About the Summit
Conference Chair Welcome Statement
Why Attend
Travel
Press Releases
Contact Us
Call for Presentations
The Call for Presentations closes on September 6th, 2024
About the Presenter
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Short biography of the presenter(s)
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Presenter's Affiliation
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(Please do not include Inc, Co, Corp, LTD, etc.)
Brief description of the affiliation
About the Presentation
Topic Category:
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You may only choose
1
selection
)
Applications
Acceleration
AI Chips
Analog
ASICs
Automotive
Communications Chips
Memories
Processors
Characteristics
Technology
Design Methods
Design-for-Manufacturability
Design-for-Test
Ecosystem
Foundries
Intellectual Property (IP)
Interfaces
Platforms
Standards
Tools
Packaging
3D Packaging
Bonding
Chip/package co-design
Packaging tools/platforms
Procedures
Cost Analysis
System-Technology Co-Optimization (STCO)
Requirements
Power
Thermal
Stages
Design
Integration
Partitioning
Test
Technology Areas
High-Performance Computing (HPC)
Networking
Security
Test/Development Hardware
Interposers
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Presentation Title
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Presentation Abstract
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