Conference Chair’s Post-Event Message for Chiplet Summit 2023
Chuck Sobey, Conference Chair
Thanks to our sponsors, exhibitors, keynoters, organizers, moderators, speakers, and attendees for making the 1st annual Chiplet Summit a success! Our exhibit floor was full of activity and popular panels were standing-room-only.
We set out to develop an insightful, leading-edge program for attendees to learn about chiplet design, integration, packaging, test, and standards. We created a place where they could get insight into industry trends from panels, and from keynotes by major players and hot newcomers: Applied Materials, proteanTecs, Silicon Catalyst (US CHIPS Act), Intel, Corigine, and the Open Compute Project (with their vision of an open chiplet economy).
Heterogeneous integration of chiplets and new approaches to disaggregation, packaging, and test will keep semiconductor innovation flowing. Big designs will come to market faster and be more scalable and more modular. Chiplet Summit intends to be the must-attend annual event where everyone shares ideas and best practices, makes new connections, and sets the industry’s direction.
Help grow the chiplet ecosystem by being part of our 2nd Annual Chiplet Summit, January 23-25, 2024 in San Jose! Please email Elizabeth Leventhal ([email protected]) if you want to join our Organizing Committee for CS24.