The 4th annual Chiplet Summit is our biggest yet, reflecting the growing importance of chiplets. The Summit offers practical education for chip and package designers. They will learn how to select the best package for applications, design the most efficient die-to-die interfaces, and work productively with foundries. In tutorials, paper sessions, panels, and forums, attendees will learn how to interface the latest HBM chips, create high-speed AI accelerators, and reduce applications’ power consumption. A brand new topic is the development of systems with 100 or even 1,000 chiplets!

Attend the pre-conference day for tutorials, our Superpanel, and our most popular networking event – Beer, Pizza, and Chat with the Experts. In the exhibit hall on Wednesday and Thursday, you’ll see industry-leading products from Synopsys, Cadence, Siemens, Alphawave Semi, Marvell, and many other companies. No one else has anything close to our chiplet coverage. Come enjoy the best chiplet event ever!