Press Releases

Chiplet Summit to Focus on New Packages and AI Applications in 2025

SAN DIEGO, CA – July 23, 2024 – Chiplets Increase Performance and Lower Cost Chiplet Summit announces its third annual event on January 21-23 at the Santa Clara Convention Center. The 2025 meeting focuses on a new level in chip design: system-in- package (SiP). SiPs use advanced packaging to raise performance and reduce time-to-market. Co-optimization methods allow all design stages to proceed together. The event also covers supercomputer-in-a-package, a low-cost way to support generative AI.

Click to Download the Full Press Release

Chiplet Summit Reports Rapid Growth in Successful Second Year

SAN DIEGO, CA – February 26, 2024 – Chiplet Summit held its second annual event at the Santa Clara Convention Center on February 6-8. Both registration (883) and total attendance (534) increased by over two-thirds from 2023. Key areas of interest were advanced packaging methods, high-speed die-to-die interfaces, generative AI applications, and the open chiplet economy. Keynoters were Applied Materials, Synopsys, Micron, Alphawave Semi, Hyperion Technologies (new packaging methods), and Open Compute Project.

Click to Download the Full Press Release

Market Research Joint Release with YOLE GROUP

SAN DIEGO, CA – January 31, 2024 - Chiplet Summit announces Yole Group is returning as its market research partner for its second annual event. The Summit is on February 6-8 at the Santa Clara Convention Center. Yole Group will analyze the chiplet market and cover both short and long-term trends.

Click to Download the Full Press Release

MIT Technology Review has just named “chiplets” as one of their ten breakthrough technologies for 2024!

SAN DIEGO, CA — January 16, 2024 — Pre-registration is now open for Chiplet Summit’s second annual event on February 6-8 at the Santa Clara Convention Center. Hundreds of registrants and many key exhibitors will be at the premier showcase for chiplet technology. All major chip makers have adopted chiplets as their approach to producing devices at leading-edge nodes.

Click to Download the Full Press Release

Pre-Registration Opens for Chiplet Summit

SAN DIEGO, CA – January 9, 2024 – Chiplet Summit opens pre-registration today for its second annual event on February 6-8 at the Santa Clara Convention Center. Hundreds of registrants and many key exhibitors will be at the premier showcase for chiplet technology. All major chip makers have adopted chiplets as their approach to producing devices at leading-edge nodes.

Click to Download the Full Press Release

Chiplet Summit Features the Latest Chip Design Technology

SAN DIEGO, CA – December 11, 2023 – Chiplet Summit’s 2024 event offers the last word on leading-edge design at the Santa Clara Convention Center on February 6-8. The Tuesday tutorials cover advanced packaging technologies, AI in chiplet design, die-to-die interfaces, working with foundries, and the Open Chiplet Economy.

Click to Download the Full Press Release

Generative AI is today’s biggest technology news, and Chiplet Summit is therefore making it the focus of the 2024 event at the Santa Clara Convention Center on February 6-8.

SAN DIEGO, CA – December 4, 2023 – Chiplet Summit 2024 Focuses on Accelerating Generative AI

Click to Download the Full Press Release

Chiplet Summit has quickly become the key show in a technology that AMD, Intel, NVIDIA, and Samsung all say is strategic to their futures

SAN DIEGO, CA – November 13, 2023 – Chiplet Summit Is the Only Event Covering All Aspects of Developing Chips at the Smallest Process Nodes

Chiplet Summit has quickly become the key show in a technology that AMD, Intel, NVIDIA, and Samsung all say is strategic to their futures. The 2024 event at the Santa Clara Convention Center on February 6-8 covers architectures, design methods, interfaces, packaging, and integration. .

Click to Download the Full Press Release

Get the Scoop on Chiplet Market Research

SAN DIEGO, CA — (BUSINESS WIRE) — December 13, 2022 — Chiplet Summit Partners with Yole Group to Offer the Latest Results

Chiplet Summit announces Yole Group as its market research partner for its first annual event. The Summit will occur on January 24-26 at the Doubletree San Jose. Yole Group will analyze the chiplet market and cover both short and long-term trends. .

Click to Download the Full Press Release

Chiplet Summit Helps Advance Chiplet Technology

SAN DIEGO, CA — (BUSINESS WIRE) — December 9, 2022 — Chiplets Shorten Chip Design Cycles. Chiplet Summit opens pre-registration today for its first annual event.

It will occur on January 24-26 at the Doubletree by Hilton San Jose. Hundreds of registrants and many key exhibitors will be at the first showcase for chiplet technology, the latest approach for developing state-of-the-art chips. All leading chip makers have adopted chiplets as their approach to making devices at process nodes of 5 nm and below. .

Click to Download the Full Press Release

Chiplet Summit Announces its Initial Keynote Schedule

SAN DIEGO, CA – November 15, 2022 – Emphasis is on semiconductor design, packaging, test, and integration in the chiplet era

The first annual Chiplet Summit, to occur on January 24-26, 2023 at the Doubletree by Hilton San Jose, has now set its initial keynote schedule

Click to Download the Full Press Release

Chiplet Summit Helps Advance Chiplet Technology

SAN DIEGO, CA – October 18, 2022 –Chiplets Need an Event Covering All Aspects of Development

Chiplet Summit is a major addition to the chiplet ecosystem. Debuting at the Doubletree by Hilton San Jose on January 24-26, 2023, it covers architectures, design methods, interfaces, packaging, test and integration, and standards.

Click to Download the Full Press Release

Chiplet Summit Covers All Aspects of Big Chip Development

SAN DIEGO, CA – September 13, 2022 – Chiplets Offer Designers a Drop-In Approach

Chiplet Summit will be the first event to include all aspects of chiplet-based development. Debuting at the Doubletree by Hilton San Jose on January 24-26, it will cover partitioning, architecture, design methods, interfaces, packaging, and test and integration. Sessions will focus on handling new process nodes, reducing costs, and allowing easy drop-in of existing designs. Attendees will learn how to increase modularity and create markets for chiplet IP. The results are designs that perform better and shrink time-to-market.

Click to Download the Full Press Release

Chiplet Summit Helps Designers Create Huge Chips

SAN DIEGO, CA – August 18, 2022 – Chiplets Reduce Development Time and Cost

Chiplet Summit debuts at the San Jose Doubletree Hotel on January 24-26, 2023. It focuses on techniques that extend Moore’s Law to ever-smaller dimensions. Chiplets reduce costs, increase modularity and scalability, and avoid wastage and manufacturing defects. Chiplets lead to better chips and faster time-to-market.

Click to Download the Full Press Release